| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3b3cf8bdd784a9b0c647cc2b23ee5de8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0716 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| filingDate |
2010-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a56028abd56da8daeb8f19148790a94 |
| publicationDate |
2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2010108795-A1 |
| titleOfInvention |
Pre-treatment process for electroless nickel plating |
| abstract |
The present invention discloses a process for electroless plating of nickel onto copper features of a printed circuit board which suppresses extraneous nickel plating. The process comprises the steps i) activation of the copper features with palladium ions; ii) removal of excessive palladium ions or precipitates formed thereof with a pre-treatment composition comprising at least two different types of acids wherein one type is an organic amino carboxylic acid and iii) electroless plating of nickel. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014120263-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017191165-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9783890-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9499910-B2 |
| priorityDate |
2009-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |