| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1639 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2012-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e797ff8d40f528147d33c572d4a63996
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6ced35ab9b714a96a02cdeaa6f1108e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfb236ebecdae446fdae096ccbd5b7ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bfd330e901d6588b5963860e4d8e28a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3da8baa71e616ecfb134d4ebcca7f3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88614165603636d574f448bfe8347a4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e86e6371cf263d5e277344559d69d8b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b275a73426424c66986c04e042760a1 |
| publicationDate |
2017-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9783890-B2 |
| titleOfInvention |
Process for electroless plating and a solution used for the same |
| abstract |
A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11174402-B2 |
| priorityDate |
2012-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |