http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010039284-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e2484c77d77924d6640c6039a57ed7bb
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1608
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2009-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4c6f082d6685829e9f3602b26e6c283
publicationDate 2010-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2010039284-A1
titleOfInvention Silicon carbide barrier diode
abstract Improved semiconductor devices are fabricated utilizing nickel gallide and refractory borides deposited onto a silicon carbide semiconductor substrate. Varying the deposition and annealing parameters of fabrication can provide a more thermally stable device that has greater barrier height and a low ideality. This improvement in the electrical properties allows use of Schottky barrier diodes in high power and high temperature applications. In one embodiment, a refractory metal boride layer is joined to a surface of a silicon carbide semiconductor substrate. The refractory metal boride layer is deposited on the silicon carbon semiconductor substrate at a temperature greater than 200 ∘ C. In another embodiment, a Schottky barrier diode is fabricated via deposition of nickel gallide on a SiC substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109917261-A
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priorityDate 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.