| abstract |
The present invention provides an aqueous CMP slurry composition that includes abrasive particles and from about 0.01 % to the limit of solubility in water of a compound according to Formula (I): wherein only one of R 1 , R 2 , R 3 , R 4 and R 5 is a hydroxyl group (-OH), only one of R 1 , R 2 , R 3 , R 4 and R 5 is a methoxy group (-OCH 3 ), and the three of R 1 , R 2 , R 3 , R 4 and R 5 that are not either a hydroxyl group (-OH) or a methoxy group (-OCH 3 ) are hydrogen atoms (-H). |