| abstract |
FIELD: chemistry. n SUBSTANCE: invention relates to aqueous polishing compositions for polishing materials of substrates of electrical, high accuracy mechanical and optical devices. Aqueous polishing composition contains: (A) at least one water-soluble or water-dispersible compound, selected from N-substituted N'-hydroxy-diazenium oxides, and (B) abrasive particles, containing cerium oxide or consisting of it. Described also is a method of polishing materials to achieve desired flatness using said composition. n EFFECT: proposed polishing composition provides improved oxide/nitride selectivity and improved global and local flatness of polished materials of electrical, mechanical and optical devices. n 9 cl, 2 tbl, 6 ex |