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publicationDate 2010-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2010010753-A1
titleOfInvention Wiring board and method for manufacturing the same
abstract Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.
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