Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f26961bb79f1b1be66739316fb86fcc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77eadbd20549099ae084064f6c296a5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_371290089320f9469a0809aea17b2a22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_942b5507e43faa778b6a4bdc0c59408a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_50baf0d4a008ca590f20e254407a35c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62c4be508c6b4305538255a0b0878bc3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b639631028b6664b3e0b11f113f6fde4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a630e378e18e9afddc56bf551bbd5e77 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31608 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0338 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3185 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 |
filingDate |
2009-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9254b082bc21ea67a82e023eb6429ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6774706c6d70cb16cf6f723d572cfba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7ca395712180fc8e64b912926384f34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4bd6dbc6921a2a8af8db374d5983bcd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a19013a8b952a1584e2679f70530fb45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5a95ec5264024c25c66789c387ceea5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ef9479886c08bfd3cb9b8f562bb8173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f54e34eccc69d23a6be678c39cb471c |
publicationDate |
2009-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2009140094-A2 |
titleOfInvention |
Method for critical dimension shrink using conformal pecvd films |
abstract |
A method and apparatus for forming narrow vias in a substrate is provided. A pattern recess is etched into a substrate by conventional lithography. A thin conformal layer is formed over the surface of the substrate, including the sidewalls and bottom of the pattern recess. The thickness of the conformal layer reduces the effective width of the pattern recess. The conformal layer is removed from the bottom of the pattern recess by anisotropic etching to expose the substrate beneath. The substrate is then etched using the conformal layer covering the sidewalls of the pattern recess as a mask. The conformal layer is then removed using a wet etchant. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014090188-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111627809-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9234277-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8785333-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011166060-A |
priorityDate |
2008-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |