| abstract |
Disclosed is a photosensitive resin composition which enables the formation of a pattern thereon, and can be formed into a flexible dry film that produces a sufficiently reduced quantity of cutting dusts when the film is cut. Specifically disclosed are: a photosensitive resin composition comprising (A) an alkali-soluble phenolic resin, (B) a photosensitizing agent having a 1,2-naphthoquinonediazide group, and (C) an alkali-soluble resin having a group derived from an aromatic hydroxy compound in a side chain; and/or a photosensitive resin composition comprising (A) an alkali-soluble phenolic resin, (B) a photosensitizing agent having a 1,2-naphthoquinonediazide group, and (D) a compound which is induced from at least one compound selected from the group consisting of Bisphenol A, Bisphenol E, Bisphenol F, Bisphenol S and a compound produced by hydrogenating any one of the above-mentioned compounds and which has at least one hydroxy group at the terminal. |