| abstract |
Disclosed is a positive radiation-sensitive resin composition characterized by containing (A) a hydrolysis product of an organosilane represented by formula (1) and/or a condensate thereof, (B) at least one resin selected from the group consisting of polyacrylamides, poly(N-vinylpyrrolidone)s, polyoxazolines and the like, and (C) a quinonediazide compound. Since a cured product obtained from the positive radiation-sensitive resin composition has excellent melt properties and heat resistance, a good microlens can be produced therefrom. SiR1 aR2 b (1) [In the formula, R1 represents an alkoxyl group having 1-6 carbon atoms or an aryloxy group having 6-18 carbon atoms; R2 represents an alkyl group having 1-6 carbon atoms, an alkenyl group having 2-6 carbon atoms, an aryl group having 6-18 carbon atoms or an allyl group; and a represents an integer of 1-4 and b represents an integer of 0-3, provided that a + b is 4.] |