| abstract |
Disclosed is a novel polyimide resin wherein a reactive group, which is capable of forming a crosslinking point by reacting with a crosslinking agent, is introduced in advance of imidization. A dry film or a photosensitive cover film made from a photosensitive polyimide resin containing the novel polyimide resin can be provided with a relatively low elastic modulus and heat resistance because of the novel polyimide resin. Specifically disclosed is a novel polyimide resin which is obtained by imidizing a diamine component containing an amide group-containing siloxane diamine compound represented by the formula (1) below and an acid dianhydride component containing an aromatic acid dianhydride such as 3,3',4,4'-diphenyl sulfone tetracarboxylic acid dianhydride. In the formula (1), R1 and R2 independently represent an optionally substituted alkylene group; m represents an integer of 1-30; and n represents an integer of 0-20. |