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filingDate 2008-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_386d6994c187402d4cd178d0bbc638bd
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publicationDate 2008-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2008093626-A1
titleOfInvention Chip element and process for producing the same
abstract A glass paste composed mainly of a siliceous glass as an insulating material and containing a photosensitive material added thereto is coated on a parent substrate. The glass paste is then exposed to light through a photomask to cure the glass paste. The glass paste in its parts remaining uncured is then removed to form openings. The cured glass paste is then fired to form a glass layer. Subsequent to the above series of steps, the formation of the glass layer is followed by the formation of a plurality of plating layers on a silver electrode on the bottom of the openings of the glass layer to form an electrode for bonding. The constitution comprising the above steps can realize the manufacture of a chip element without the need to use a resist for electrode formation while reducing the amount of the metallic material in the electrode for wire bonding and can realize a reduction in production cost and enhanced properties.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200056463-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9887668-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9660584-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10771024-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10090812-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10937759-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016122846-A
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