| abstract |
A power amplifier module used in wireless communication is provided. A power amplifier module includes a power amplifier configured to receive a radio frequency (RF) signal and supply an amplified RF signal, and a wire bond pad 113 electrically connected to the power amplifier. The wire bond pad includes a nickel layer 127 having a thickness of less than 0.5 μm, a palladium layer 128 over the nickel layer, and a gold layer 129 over the palladium layer. The power amplifier module further includes a conductive trace, the conductive trace includes a top surface portion having a plated portion and a non-plated portion surrounding the plated portion, and the wire bond pad is disposed on the plated portion. [Selection] Figure 4 |