| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_16ebbf2b5f669829588fc45dd1118668
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f257e14410bf8a38e1bae19608c3681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_da1eca4375b85213141184827378d49f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_db309613a158ecea3a7a1bf5d83dbc6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d7e29d377ca71855697e48ae6d0d53e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ccca7ad7a1814082c3bd5d0ed11825da |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1632
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C8-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C10-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C8-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C10-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate |
2007-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec2c0130c405a9f5be1fd1ad620c1846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f88514a75877a04c19be758319d61c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d8cd8337e042bbd5e5fbe950489fd5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c01581e39579149846be9dbe5657414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ceca8a77abbc45403cb2e2b4ffa76b7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_174daf5c7eada11139ec477946cc8a4d |
| publicationDate |
2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2008076677-A1 |
| titleOfInvention |
Methods and systems for barrier layer surface passivation |
| abstract |
This invention pertains to methods and systems for fabricating semiconductor devices. One aspect of the present invention is a method of depositing a gapfill copper layer onto barrier layer for semiconductor device metallization. In one embodiment, the method includes forming the barrier layer on a surface of a substrate and subjecting the barrier layer to a process condition so as to form a removable passivated surface on the barrier layer. The method further includes removing the passivated surface from the barrier layer and depositing the gapfill copper layer onto the barrier layer. Another aspect of the present invention is an integrated system for depositing a copper layer onto a barrier layer for semiconductor device metallization. In one embodiment, the integrated system comprises at least one process module configured for barrier layer deposition and passivated surface formation and at least one other process module configured for passivated surface removal and deposition of copper onto the barrier layer. The system further includes at least one transfer module coupled so that the substrate can be transferred between the modules substantially without exposure to an oxide-forming environment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7592259-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7749893-B2 |
| priorityDate |
2006-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |