| abstract |
Disclosed is a polymerizable composition suitable as an electrical material for use in an electrical circuit board or the like, which comprises a norbornene monomer, a metathesis polymerization catalyst and a chain transfer agent comprising a compound represented by the formula (A): CH2=CH-Y-OCO-CR1=CH2 [wherein Y represents a bivalent hydrocarbon group having 3 to 20 carbon atoms; and R1 represents a hydrogen atom or a methyl group]. The polymerizable composition may further contain a crosslinking agent. The resulting mixture is subjected to bulk polymerization to produce a crosslinkable resin. By crosslinking the crosslinkable resin, a molded article or a crosslinked resin complex can be produced which is excellent in properties including an electrical insulating property, an adhesion property, mechanical strength, heat resistance and a dielectric property. |