| abstract |
Disclosed is a curable resin composition containing 100 parts by weight of an alicyclic olefin polymer (A), 1-100 parts by weight of a curing agent (B), 10-50 parts by weight of a salt of a basic nitrogen-containing compound and phosphoric acid (C), and 0.1-40 parts by weight of a condensed phosphoric acid ester (D), while having a phosphorus element content of not less than 1.5% by weight. The curable resin composition is excellent in moisture resistance, flame retardancy, surface smoothness, insulation and crack resistance, and enables to obtain a molded body or composite body which hardly generates harmful substances when incinerated. A multilayer circuit board is obtained by such a process wherein the composition is molded into a sheet, then the sheet is arranged and cured on an inner layer substrate for forming an electrically insulating layer, and then a conductor layer is formed on the electrically insulating layer. |