| abstract |
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties, while securing practical surface curability and deep-section curability. Specifically disclosed is a curable composition characterized by containing (A) 1-80 parts by weight of an organic polymer having a reactive silicon group such as an alkyldialkoxysilyl group in a molecule, (B) 99-20 parts by weight of an organic polymer having a reactive silicon group such as a trialkoxysilyl group in a molecule, wherein the main chain backbone contains a repeating unit common with that of the component (A), and (C) 0.1-30 parts by weight of an amidine compound per 100 parts by weight of the total of the components (A) and (B). |