| abstract |
The present invention provides a curable composition using a hydrolyzable silicon group-containing compound which is excellent in curing speed and heat resistance and does not contain an organic lead compound and an organic tin compound. 100 parts by mass of a hydrolyzable silicon group-containing compound; The curable composition containing 0.1-30 mass parts of biguanide compounds represented by following formula (1). [Chemical 1] (In the formula, R represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an alkoxy group or an ester group.) [Selection figure] None |