| abstract |
A molding die or master pattern for electroforming characterized by comprising a die or master pattern and a release layer comprising a thin organic film formed on the surface of the die or pattern by bringing the die or pattern into contact with an organic-solvent solution containing a silane surfactant represented by the formula [1]: Rn-Si-X4-n (1) (wherein R represents an optionally substituted C1-20 hydrocarbon group, an optionally substituted C1-20 halogenated hydrocarbon group, a C1-20 hydrocarbon group containing a connecting group, or C1-20 halogenated hydrocarbon group containing a connecting group; X represents hydroxy, halogeno, or C1-6 alkoxy or acyloxy; and n is an integer of 1-3) and a catalyst capable of interacting with the silane surfactant. The release layer is excellent in wearing resistance and release performance. |