| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f0047cdcce51cefffe48c1ec5a35a16d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-26175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 |
| filingDate |
2005-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc93eb98e219e9c624004f07aed191d1 |
| publicationDate |
2005-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005108459-A1 |
| titleOfInvention |
Liquid epoxy resin composition |
| abstract |
A low-viscosity liquid epoxy resin composition capable of providing an electronic component device that even when having a defect in electrical connection after once underfilling, permits removal of any residual at about room temperature to thereby excel in repair easiness, and that when in connected and mounted structure, ensures high reliability. With respect to an electronic component device having a semiconductor part mounted on a circuit substrate in such a fashion that an electrode part for connection provided on the semiconductor part is opposed to an electrode part for connection provided on the circuit substrate, there is provided a liquid epoxy resin composition for resin-sealing any gap between the circuit substrate and the semiconductor part. The liquid epoxy resin composition comprises not only the undermentioned constituents (A)-(C) but also the undermentioned constituent (D): (A) liquid epoxy resin, (B) aromatic diamine curing agent, (C) inorganic filler, and (D) organic additive. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111936575-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012046636-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019187588-A1 |
| priorityDate |
2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |