http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003119251-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 |
| filingDate | 2001-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b8d50fff6826f2fbadc5d0e0eb5f824 |
| publicationDate | 2003-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003119251-A |
| titleOfInvention | Liquid epoxy resin composition |
| abstract | (57) [Summary] [Problem] To provide a liquid epoxy resin composition capable of repairing even an electronic component device having a defect in electrical connection once underfilled. A circuit board of an electronic component device in which a semiconductor element is mounted on a circuit board in a state where a connection electrode section provided on a semiconductor element and a connection electrode section provided on a circuit board face each other. Liquid epoxy resin composition for resin-sealing the gap between the semiconductor device and the semiconductor device. The liquid epoxy resin composition contains the following component (D) together with the following components (A) to (C). (A) Liquid epoxy resin. (B) a curing agent. (C) an inorganic filler. (D) N, N, N ', N'-4 substituted fluorinated aromatic diamine compounds. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005108483-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005108459-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005021914-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005175337-A |
| priorityDate | 2001-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 165.