| abstract |
A production process by which thick deposits, such as bumps or wirings, can be formed by plating with satisfactory precision; a positively radiation-sensitive resin composition which is suitable for use in the production process and is excellent in sensitivity, resolution, etc.; and a transfer film comprising the composition. The positively radiation-sensitive resin composition comprises (A) a polymer having structural units (a) represented by the following general formula (1) and/or (2) and an acid-dissociable functional group (b), (B) an ingredient which generates an acid upon irradiation with a radiation, and (C) an organic solvent. A positively radiation-sensitive resin film comprising the composition can also be produced. |