| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0991bd7946508868213dfe1c1011187f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66fc32f2789223fce85f7e9d7a5da2ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c7b2e5b442c5636de4ff944207e449e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate |
2004-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eda43c08ef59cadc75dfff0a70a6e52a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f9e96746f727a658011031e36030c19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8a34aa138ce9f450aed502c1a11f7b7 |
| publicationDate |
2005-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2005026841-A1 |
| titleOfInvention |
Photosensitive insulating resin composition and cured product thereof |
| abstract |
[PROBLEMS] A photosensitive insulating resin composition is disclosed which can be cured at low temperature without interfering with functions of an organic semiconductor device or the like. The photosensitive insulating resin composition enables to obtain a cured product which is excellent in various characteristics such as resolving power, electrical insulation, thermal shock resistance and chemical resistance, and is preferably used for surface protecting films and interlayer insulating films of semiconductor devices. [MEANS FOR SOLVING PROBLEMS] The photosensitive insulating resin composition is characterized by containing a copolymer (A) which is obtained by copolymerizing monomeric units including a vinyl monomer having an epoxy group and another vinyl monomer having an oxetanyl group, and a photo acid-generating agent (B). The copolymer (A) is preferably obtained by copolymerizing monomeric units including a vinyl monomer having an epoxy group, another vinyl monomer having an oxetanyl group, and still another vinyl monomer. |
| priorityDate |
2003-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |