| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c76eaa44c60706d53b31bdb66e131bc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c64531356fad705fe3d75434ddce4c56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_950bce8d103dab1bd282965fde47f9f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_809e708360cfadf46e0a7b2df4e86c18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_483eb988affa68e523bf5ae258e93aac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d4e01cf0477209665413905020a38924
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e2ce13f2f72330893ade48553a676ee7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31695
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-46 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-314 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-56 |
| filingDate |
2004-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d11192b2c9cdcad605dcd2bc9ab2e4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_159a0f42148ed12c46d16564df52f259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6befc3d2803ddde27c24bd8ecdd9887c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52aab127e653788f9a848019bd6ec374
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6783b67e0727875c6200f499a3b1684a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_076941180242643e6e6ae1e74571a47c |
| publicationDate |
2004-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004066374-A1 |
| titleOfInvention |
Fluorine-free plasma curing process for porous low-k-materials |
| abstract |
Low dielectric constant porous materials with improved elastic modulus and material hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material with a fluorine-free plasma gas to produce a fluorine-free plasma cured porous dielectric material. Fluorine-free plasma curing of the porous dielectric material yields a material with improved modulus and material hardness, and with comparable dielectric constant. The improvement in elastic modulus is typically greater than or about 50%. |
| priorityDate |
2003-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |