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filingDate 2003-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_551430b79c0949db5653f7c984a018eb
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publicationDate 2003-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-03104295-A1
titleOfInvention Acenaphthylene modified phenolic resin and epoxy resin composition
abstract An acenaphthylene modified phenolic resin which is prepared by allowing 100nparts by weight of a phenol resin or a polyhydric phenol to react with 3 to 50 partsnby weight of acenaphthylenes, so as to effect the addition reaction of 30 to 100nmole % of the acenaphthylenes to the phenol resin or the polyhydric phenol; andnan epoxy resin prepared from the acenaphthylene modified phenolic resin. Thenacenaphthylene modified phenolic resin is useful as a curing agent for an epoxynresin intermediate and an epoxy resin. The epoxy resin is excellent in thermalnresistance, flame retardency and also low hygroscopicity, and thus is suitablenfor use in sealing electric and electronic parts and as a material for a circuitnboard or the like.
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