| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F32-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L45-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8896389057e9be1306a662309cac1896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9d037581b7c3e100ed7068c2475d3f9 |
| publicationDate |
2001-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001294623-A |
| titleOfInvention |
Aromatic oligomer, phenolic resin composition containing the same, epoxy resin composition and cured product thereof |
| abstract |
PROBLEM TO BE SOLVED: To provide an aromatic oligomer useful as a modifier of an epoxy resin composition, a phenol resin composition containing the same, an epoxy useful for encapsulating electric / electronic parts, a circuit board material, etc. A resin composition is provided. SOLUTION: An aromatic oligomer having a softening point of 80 ° C to 250 ° C obtained by polymerizing a monomer mainly containing an aromatic olefin containing at least 20% by weight of acenaphthylenes. A phenol resin composition or an epoxy resin composition containing the aromatic oligomer in an amount of 3 to 200 parts by weight based on 100 parts by weight of the phenol resin or the epoxy resin; and an epoxy resin obtained by curing the epoxy resin composition. Cured product. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004307545-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03104295-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101114662-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002020454-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7847284-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101003624-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013107981-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03080732-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4529247-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005516382-A |
| priorityDate |
2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |