| abstract |
The invention relates to a method for producing a copy protection for an integrated circuit. The aim of the invention is to provide an effective and reliable copy protection in order to prevent an unauthorized copying of an integrated circuit. To this end, the invention presents a method comprising the following steps: providing a substrate (1) having semiconductor structures (2) on at least one first side (1a) of the substrate (1); providing a material for coating the substrate (1), and; coating the substrate (1) with a copy protection layer (4). It has been advantageously proven to produce the copy protection layer (4) by vapor depositing a silicate glass so that an etching method, which removes the copy protection layer, also acts upon the substrate (1) whereby at least partially destroying the semiconductor structures (2). |