Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3d5128e9e7cb655d92e9c11449f63ed1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d619693258437500af8f329415dc1689 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
filingDate |
2001-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3145773aef6c3fa53d577a2db395492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40e33d88062b8feac64728d61937ee73 |
publicationDate |
2002-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-0232966-A1 |
titleOfInvention |
Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board |
abstract |
A photosensitive resin composition excellent in heat resistance, processability and adhesion; a solder resist comprising the composition; and a cover lay film and printed circuit board obtained from or with these. The cover lay film has excellent processability and adhesion at relatively low temperatures while retaining sufficient mechanical strength, gives a cured film having a low modulus, and is suitable for use in producing printed boards or hard disks. The solder resist is soluble, can be laminated at a temperature not higher than 150°C, and can be applied directly to an FPC without through an adhesive. The cover lay film is excellent in various properties including heat resistance and causes little warpage when laminated to an FPC. The photosensitive resin composition comprises as essential ingredients (A) a soluble polyimide which is soluble in solvents having a boiling point of 120°C or lower and (B) a compound having one or more aromatic rings and two or more double bonds per molecule, wherein the soluble polyimide is one obtained at least from an acid dianhydride having one to six aromatic rings or alicyclic acid dianhydride and/or a diamine having one to six aromatic rings. The solder resist, cover lay film, etc. are excellent in heat resistance and mechanical properties and do not damage the substrates because they can be laminated at a relatively low temperature. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004092838-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004109403-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7476476-B2 |
priorityDate |
2000-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |