| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c224be0c9c6da3b8dcc7ec6c5fe10833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a0e01dfc0bd8c8c8ba3aeebe8b5b202
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c52dbbdc058aa48a503b5bea1f71325 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32082 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J19-08 |
| filingDate |
2001-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_619c0b6dc9765f15c57c2d87027b7344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dcba2fa25dbdf6aafbbc8445f77e973 |
| publicationDate |
2002-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0227755-A2 |
| titleOfInvention |
Chamber configuration for confining a plasma |
| abstract |
A plasma confining assembly for minimizing unwanted plasma formations in regions outside of a process region in a process chamber is disclosed. The plasma confining assembly includes a first confining element and second confining element positioned proximate the periphery of the process region. The second confining element is spaced apart from the first confining element. The first confining element includes an exposed conductive surface that is electrically grounded and the second confining element includes an exposed insulating surface, which is configured for covering a conductive portion that is electrically grounded. The first confining element and the second confining element substantially reduce the effects of plasma forming components that pass therebetween. Additionally, the plasma confining assembly may include a third confining element, which is formed from an insulating material and disposed between the first confining element and the second confining element, and proximate the periphery of the process region. The third confining element further reduces the effects of plasma forming components that pass between the first confining element and the second confining element. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007521654-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8012306-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006511059-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7838086-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006135924-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007100528-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8911590-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8518211-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10529539-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10546727-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7849815-B2 |
| priorityDate |
2000-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |