| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_256c5efe5f82c79ee23a51b4923d7e3e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c6ae0cb4fb612992dd807cb88fe71a77 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B31-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B31-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B31-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B31-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2001-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55a557ed8d7492ceca58383905334560
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc7002a69c1ed3532473b96e55ff5163 |
| publicationDate |
2002-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-02059953-A1 |
| titleOfInvention |
Conductor treating single-wafer type treating device and method for semi-conductor treating |
| abstract |
A single-wafer type treating device (20) has a mounting table (40) disposed in a treating room (24) housing a substrate to be treated (W). The mounting table (40) has a heat conductive mounting surface (41) to mount the substrate (W) thereon. Flow passages (50) that allow a heating medium for regulating the temperature of the substrate (W) via the mounting surface (41) to flow are formed in the mounting table (40). A heating medium supply unit (54) for selectively supplying a cooling medium and a heating_medium is connected to the flow passages (50). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7750654-B2 |
| priorityDate |
2001-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |