| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a08f40258cc4226e087b75f76a009cd6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_399d433982220f3203f7f18db8c9aa28 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-2421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0466 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R33-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-1069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06716
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06722
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 |
| filingDate |
2001-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_966bb03b68460ac83a8bfb81ed6288ff |
| publicationDate |
2002-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0201232-A1 |
| titleOfInvention |
Conductive contact |
| abstract |
A conductive contact which is used for an apparatus for testing semiconductor devices and circuit boards having solder ball- or solder-deposited terminals, or for the sockets of semiconductor devices, wherein at least a conductive contact portion of the conductive contact is provided with a layer consisting of a solder-incompatible, highly conductive material so as to reduce the deposit of solder to the contact portion from an element to be contacted and significantly increase the number of contacts up to a cleaning time due to an increase in the deposited amount of solder, thereby improving a rate of operation of an inspection line and prompting a reduction in maintenance costs. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7677901-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101707546-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6844749-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1385011-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009288156-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7182817-B1 |
| priorityDate |
2000-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |