| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7400108bda65dcb718b8d4bb7f8a407b |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 |
| filingDate |
1996-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65c69ab1d978c1548a8d450a1f061c61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1868f6c0b2e17e59837407dd504bab2d |
| publicationDate |
1997-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H09232057-A |
| titleOfInvention |
IC socket |
| abstract |
(57) [Abstract] [Purpose] In an IC socket in which an IC package is mounted to electrically connect an inspection circuit board and the IC package, the solder plating applied to the leads of the IC package and the IC The gold plating applied to the surface of the contact pin of the socket causes a chemical reaction to prevent a substance having high electric resistance from adhering to the contact pin. A surface of a contact portion of the contact pin is plated with a substance having poor solder wettability and low electric resistance, and a surface of a mounting connection portion of the contact pin is plated with gold. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016166899-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7329129-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5334416-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014003003-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-RE45924-E
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0201232-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7514946-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012230117-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4669651-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014003003-A1 |
| priorityDate |
1996-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |