| abstract |
The invention relates to a method for creating negative resist structures, according to which a chemically fortified resist is applied to a substrate, dried, irradiated with light, x-ray, electron or ion beams, heated, developed using an aqueous-alkaline developer solution and silylated from a liquid phase. The resist contains the following constituents: a polymer, whose polarity is modified by acidic action and which contains carboxylic acid anhydride groups, preferably in latent form; a compound which releases an acid as a result of thermal treatment; a photoreactive compound, from which a base is created during the irradiation with light, x-ray, electron or ion beams; a solvent; optionally one or more additives. |