| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4efee27937b4a512f45809fed5293747 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 |
| filingDate |
2000-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_404d56757dde175158910523581869ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fb896a1a0ce7fed040ce2408c537350
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b51d95b29f01a36160de8aab8faf9637 |
| publicationDate |
2001-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-0106553-A1 |
| titleOfInvention |
Polishing mixture and process for reducing the incorporation of copper into silicon wafers |
| abstract |
A process for reducing the incorporation of copper into a semiconductor single-crystal silicon wafer during polishing includes the steps of: a) adding a copper-controlling additive to a polishing mixture containing copper, the copper-controlling additive reacting with the copper in the polishing mixture to form a copper compound having a solubility product (Ksp) less than about 10-20; and b) thereafter contacting a surface of the wafer with a polishing material and the polishing mixture as the wafer moves relative to the polishing material to polish the surface of the wafer. Novel polishing mixtures for use in polishing semiconductor single-crystal silicon wafers and reducing the incorporation of copper therein are also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7833435-B2 |
| priorityDate |
1999-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |