| abstract |
A resist overlayer film forming composition for use in a lithography process in semiconductor device production does not intermix with a resist, blocks undesirable exposure light particularly in EUV exposure, for example, UV and DUV and selectively transmits EUV alone, and can be developed with a developer after exposure. A resist overlayer film forming composition includes: a polymer (P) including unit structures of Formula (1) and Formula (2) and having a weight average molecular weight, measured by gel permeation chromatography, of 500 to 2,000; and a C 8-16 ether compound as a solvent |