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filingDate 2017-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9812443-B1
titleOfInvention Forming vertical transistors and metal-insulator-metal capacitors on the same chip
abstract A device with a vertical transistor and a metal-insulator-metal (MIM) capacitor on a same substrate includes a vertical transistor including a bottom source/drain, a fin channel extending vertically from the bottom source/drain to a top source/drain, and a gate arranged around the fin channel, and the gate including a dielectric layer, a gate metal, and spacers arranged on opposing sides of the gate; and a MIM capacitor including a gate arranged over the bottom source drain, the gate including a gate metal and a dielectric layer, and a metal arranged in a depression in the bottom source/drain and extending through a channel in the gate to cover the gate, the metal directly contacting the dielectric layer of the gate.
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