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filingDate 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa2a6484816068a2171611a9ce1c93d0
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publicationDate 2017-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9805936-B2
titleOfInvention Method for producing nickel thin film on a Si substrate by chemical vapor deposition method, and method for producing Ni silicide thin film on Si substrate
abstract A method for producing a nickel thin film on a Si substrate by a chemical vapor deposition method, in which the nickel thin film is formed by use of a hydrocarbon-type nickel complex represented by a following formula as a raw material compound, which is a nickel complex in which a cyclopentadienyl group (Cp) or a derivative thereof and a chain or cyclic alkenyl group having 3 to 9 carbon atoms or a derivative thereof are coordinated to nickel and an element other than carbon and hydrogen is not contained in the structure, use of hydrogen as a reaction gas, and use of a film formation pressure of 1 to 150 torr and a film formation temperature of 80 to 250° C. as film formation conditions n n(In the formula, X represents a chain or cyclic alkenyl group having 3 to 9 carbon atoms or a derivative thereof. R 1 to R 5 which are substituent groups of the cyclopentadienyl group represent C n H 2n+1 and n represents an integer of 0 to 6).
priorityDate 2013-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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