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filingDate 2015-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39875b4af4fd92ef135f51a7bd7d91f0
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publicationDate 2017-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9779961-B2
titleOfInvention Etching method
abstract Disclosed is a method for etching a first region including a multi-layer film formed by providing silicon oxide films and silicon nitride films alternately, and a second region having a single silicon oxide film. The etching method includes: providing a processing target object including a mask provided on the first region and the second region within a processing container of a plasma processing apparatus; generating plasma of a first processing gas including a hydrofluorocarbon gas within the processing container that accommodates the processing target object; and generating plasma of a second processing gas including a fluorocarbon gas within the processing container that accommodates the processing target object. The step of generating the plasma of the first processing gas and the step of generating the plasma of the second processing gas are alternately repeated.
priorityDate 2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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