| abstract |
The present invention relates to molding compositions comprisingn (A) from 29 to 89% by weight of at least one polyarylene ether sulfone having an average number of phenolic end groups per chain of from 0 to 0.2, (B) from 0.5 to 20% by weight of a thermotropic polymer, (C) from 0.5 to 10% by weight of a polyarylene ether having predominantly OH end groups, (D) from 10 to 70% by weight of at least one fibrous or particulate filler, (E) from 0 to 40% by weight of additives or processing aids,n nwhere the total of the proportions by weight is 100% by weight, based on the thermoplastic molding composition. |