Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81cfb88d909c75104c0c8d61799a72b0 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0084 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0073 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-32 |
filingDate |
2014-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_daa8dd0117d55d6889e7fad72859a351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2623587b0399e5c66ab3f9b6e44162a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aeb0d4ad6ffb45a801c21421c86b4399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f3b217c01c37c09fdf8a41d5655cb4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c12196d284e283c534ccdeaead939ae0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de4a6d60991645fc02a94e6fb1745f68 |
publicationDate |
2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9528078-B2 |
titleOfInvention |
Antioxidants for post-CMP cleaning formulations |
abstract |
An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10319605-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017096624-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9920287-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015337245-A1 |
priorityDate |
2006-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |