| abstract |
A water-soluble cutting fluid for slicing silicon ingots is characterized in that it includes a monoprotic or diprotic aliphatic carboxylic acid (A) having a carbon number (including the carbon in the carbonyl group) of 4˜10, and either a polyprotic organic acid (B) with ΔpKa of 0.9˜2.3 as defined by the following formula (1) or a salt (BA) of said organic acid (B) as essential components:n nΔpKa=(pKa 2 )−(pKa 1 ) (1)n wherein the dissociation stage, at which the organic acid (B) denoted as n-protic acid H n A, becomes H n-1 A+H + is numbered 1 with an acid dissociation constant expressed as pKa 1 , and the dissociation stage at which the organic acid (B) becomes H n-2 A+H + is numbered as 2 with an acid dissociation constant expressed as pKa 2 . |