| abstract |
Two microelectronic components ( 110, 120 ), e.g. a die and an interposer, are bonded to each other. One of the components' contact pads ( 110 C) include metal, and the other component has silicon ( 410 ) which reacts with the metal to form metal silicide ( 504 ). Then a hole ( 510 ) is made through one of the components to reach the metal silicide and possibly even the unreacted metal ( 110 C) of the other component. The hole is filled with a conductor ( 130 ), possibly metal, to provide a conductive via that can be electrically coupled to contact pads ( 120 C.B) attachable to other circuit elements or microelectronic components, e.g. to a printed circuit board. |