http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9454078-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-357 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 |
| filingDate | 2013-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a10c22008b61044d8d660c3cde26eae7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d22cceb2ffa1bbecddc1ce6499d8fb4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b65f7e80bdfcacd2624b55bbbd4abea3 |
| publicationDate | 2016-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-9454078-B2 |
| titleOfInvention | Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same |
| abstract | The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X 1 in the general formula (1) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 1 represents an aromatic diamine residue including 1 to 4 aromatic rings, and in which X 2 in the general formula (2) represents a tetracarboxylic acid residue including 1 to 4 aromatic rings, and Y 2 represents a diamine residue including at least two or more alkylene glycol units in the main chain. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11106134-B2 |
| priorityDate | 2012-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 607.