| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8797291a7543ada4b0a9946bd6b62b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f650227be58049514803c3fbdd52f31f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfbd248d8b6b2972df7c7cc537be0f50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0abd9a28700471caffb4aeb9c8d8388e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54b44f9e5e5dcffba1e8336d94835091 |
| publicationDate |
2015-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9144880-B2 |
| titleOfInvention |
Soft and conditionable chemical mechanical polishing pad |
| abstract |
A chemical mechanical polishing pad for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate is provided containing a polishing layer, wherein the polishing layer comprises the reaction product of raw material ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm 3 ; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10464187-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11179822-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10875144-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9484212-B1 |
| priorityDate |
2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |