| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_53db4cca559bf0c7dbbd1517985ed4c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e9059c03350380e5577b50d44e3f4b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20aa72cb9d15212d1141eebb01263f0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_753e7b02312783388292dd23fe0d400b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12396 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-02 |
| filingDate |
2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_597ace27226a428d6d98055aca2b9695
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c77841b36276fbe251d0ef1b20a301f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92aadfd8e93e7066f6953c96fcd5de59 |
| publicationDate |
2014-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8764960-B2 |
| titleOfInvention |
Manufacturing methods for metal clad laminates |
| abstract |
The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10076028-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10076032-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011003086-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10237976-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11413376-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9107317-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9839138-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017127516-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11759551-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11730863-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014377455-A1 |
| priorityDate |
2006-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |