| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f645124007aa341ebc1fc5fc5bfcf1b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c389d310f52125a947b3408cb0cf3283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d486fade55ac9c1caa66998af877c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7192b2d920a461b042d84bd61c6bb909 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T409-303808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T409-304536
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49995
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T83-0304 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23B5-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-00 |
| filingDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f07100d5c435c2a552c1fec30c84e01d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b71979374e8dc14d966179ef1ae6aa86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1b6e9c32d4a49abb36ba6bb2ab5b6a5 |
| publicationDate |
2013-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8517798-B2 |
| titleOfInvention |
Polishing pad, method of producing the same and method of producing semiconductor device by using the same |
| abstract |
The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017374744-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016081196-A1 |
| priorityDate |
2005-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |