Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bcd47feabc20e75f1113da78708f261b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f6db922daccc052f9396739b83facbbb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_801ed4d4fe7b49b07d1e1ade48b89d90 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-00 |
filingDate |
2007-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1721c610849406e975a6791f40dd7e97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cecb2aa86661c2cd8b3cb7a1a6115b1 |
publicationDate |
2013-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8445094-B2 |
titleOfInvention |
Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers |
abstract |
A circuitized substrate which includes at least one circuit layer and at least one substantially solid dielectric layer comprised of a dielectric composition which includes a cured resin material and a predetermined percentage by weight of particulate fillers, but not including continuous or semi-continuous fibers as part thereof. |
priorityDate |
2004-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |