| abstract |
An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature Tg greater than 200 DEG C. and a volumetric coefficient of thermal expansion of </=75 ppm/ DEG C. A semiconductor device is electrically attached to the laminated substrate. |