| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a228f1c7555ace58c22478bfb366acac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_abfd5318979082364dbd91dad9cc92e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4916
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2009-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81d6326f8bbefde2ddf082f68783cf17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2daa2844a34bbaa6691d549a84cd5042 |
| publicationDate |
2013-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8373069-B2 |
| titleOfInvention |
Electronic component mounting substrate and method for manufacturing electronic component mounting substrate |
| abstract |
An electronic component mounting substrate including a support layer made of resin with first and second surfaces, an organic insulation layer on the first surface of the support layer with a first surface on opposite side of the first surface of the support layer and a second surface in contact with the first surface of the support layer, an inorganic insulation layer on the first surface of the organic layer, a conductor on the second surface of the support layer, and a first conductive circuit on the second surface of the organic layer. The inorganic layer has a second conductive circuit and a pad for mounting an electronic component inside the inorganic layer. The organic layer has a via conductor inside the organic layer and connecting the first and second circuits. The support layer has a conductive post inside the support layer and connecting the first circuit and the conductor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9466554-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014301058-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9681546-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011042811-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8618666-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018350731-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10643936-B2 |
| priorityDate |
2008-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |