| abstract |
[PROBLEMS] To provide a semiconductor device substrate having fine terminals with a narrow pitch, which can be easily manufactured at low cost without using a special processing step, and a method for manufacturing the same. Make it an issue. An interposer is formed using a silicon substrate. A pyramid-shaped mounting terminal 6 is formed in the silicon substrate 2 so as to extend through the surface between the front surface and the rear surface of the silicon substrate 2 and protrude from the front surface or the rear surface. On the surface of the silicon substrate 2, a wiring layer 4 including a conductive layer electrically connected to the mounting terminal 6 is formed. Mounting terminal 6 The concave portion formed by anisotropic etching of the silicon substrate 2 is used for the pyramid shape of. |