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filingDate 2011-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2012-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_110ace490c11e5c30b2ffc70dc1c5bb1
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publicationDate 2012-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8330245-B2
titleOfInvention Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from same
abstract The disclosure relates to preparation of silicon on insulator structures with reduced unbonded regions and to methods for producing such wafers by minimizing the roll-off amount (ROA) of the handle and donor wafers. Methods for polishing wafers are also provided.
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